Bergquist GapPadHC3.0柔軟有基材間隙填充導(dǎo)熱材料

材料生產(chǎn)商：美國貝格斯（BERGQUIST）公司研發(fā)產(chǎn)品

GapPadHC3.0可供規(guī)格：

厚度(Thickness)：0.25mm 0.51mm 1.02mm 1.52mm 2.03mm 2.54mm 3.18mm

片材(Sheet)：8”×16”（203×406 mm）

卷材(Roll)：無

導(dǎo)熱系數(shù)(Thermal Conductivity)：3.0W/m-k

基材(Reinfrcement Carrier)：玻璃纖維

膠面(Glue)：雙面自帶粘性

顏色(Color)：藍(lán)色

包裝(Pack)：美國原裝進(jìn)口包裝

抗擊穿電壓(Dielectic Breakdown Voltage)（Vac）:＞5000

持續(xù)使用溫度（Continous Use Temp）：-60°~200°

GapPadHC3.0應(yīng)用材料特性：

GapPadHC3.0在非常低的壓力下，低的S系列熱阻，高的貼服性，S系列軟度。針對低應(yīng)力應(yīng)用設(shè)計(jì)

玻纖增強(qiáng)，提高加工性能和搞斯裂性

GapPadHC3.0材料應(yīng)用：

處理器，服務(wù)器S-RAMS,大容量存儲(chǔ)驅(qū)動(dòng)器，有線/無線通訊硬件，筆記本電腦，BGA封裝，功率轉(zhuǎn)換器

GapPadHC3.0技術(shù)優(yōu)勢分析：

GapPadHC3.0導(dǎo)熱界面材料系列以更好的貼服性，更高的導(dǎo)熱性能及易于應(yīng)用來滿足電子工業(yè)對導(dǎo)熱界面材料的日益增長的需要；在凹凸不平的表面，空氣間隙和表面粗糙的散熱器與電子元器件之間，廣泛的GapPadHC3.0提供一個(gè)有效的導(dǎo)熱界面。

Gap Pad® HC 3.0 is a soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. Gap Pad® HC 3.0 maintains a conformable nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness

and/or topography.

Gap Pad® HC 3.0 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. Gap Pad® HC 3.0 is supplied with protective liners on both sides.